Lightweight 94v0 PCB Board Green Mask Rogers
5880 0.254mm 0.2mm Hole Size
The increasing complexity of electronic components and switches
continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it
has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component.
To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level
of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup,
and the dielectric constant (er) of the materials used.
Get a Production PCBs Quote
Submit your PCB design
|PCB production capability|
|Files||Gerber, Protel, Powerpcb, Autocad, Orcad, Eagle,etc.|
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3,
1, 94V0,Aluminium, High frequency Material (Rogers,
|Layer No.||1 - 28 Layers|
|Board Thickness Tolerance||±10%|
|Copper thickness||0.5OZ - 4OZ|
|Min Trace Width (a)||0.005"(0.125mm)|
|Min Space Width (b)||0.005"(0.125mm)|
|Min Annular Ring||0.005"(0.125mm)|
|SMD Pitch (a)||0.012"(0.3mm)|
|pcb with green solder mask and LF-FREE surface finishing BGA Pitch
|Min Solder Mask Dam (a)||0.005"(0.125mm)|
|Soldermask Clearance (b)||0.005"(0.125mm)|
|Min SMT Pad spacing (c)||0.004"(0.1mm)|
|Solder Mask Thickness||0.0007"(0.018mm)|
|Hole size||0.01"(0.25mm)-- 0.257"(6.5mm)|
|Hole Size Tol (+/-)||±0.003"(±0.0762mm)|
|Lead free HASL||2.5um|
|Immersion Gold||Nickel 3-7um Au:1-3u''|
|Panel Outline Tol (+/-)||±0.004''(±0.1mm)|
|V-cut||15° 30° 45° 60°|
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger,
immersion silver, immersion Tin, OSP, Carbon ink,
|Certificate||ROHS ISO9001:2008 TS16949 SGS UL CE|
Buried and blind vias, Impedance control, via plug, BGA soldering
and gold finger
Materials used for HF circuit boards
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and
are primarily temperature and frequency independent.
Additional favourable properties are high glass transition
temperature, an excellent thermal durability, and very low
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance
controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Which widely be used for :
Automotive Antennas / RFID
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Airborne Antenna Systems
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital
|Rogers||RO5880||0.254 0.508 0.762||2.20 ± 0.02|
1. PCB factory directly
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical
Inspection),QA/QC,fly porbe ,Etesting
One stop PCB assembly services Samples in 2-3 days | Bulk orders in
1 week | 2-year warranties Complete OEM assembly performed in-house
Handle all customer's needs for PCB assembly,
component purchasing, and other product assemblies
We quote for clients within 3 working days
Testing: PCBA in-circuit testing, PCBA function testing, AOI, X-ray
inspection Experience range:
industrial, automotive, computing and storage And consumer,
instrumentation, medical, networking, peripherals,
Our product range covers various fields, i.e. consumer electronics,
telecommunications, industrial products, auto mobile assemblies,
medical equipments etc.
Our main services include electronics and metal, casing
manufacturing, such as PCB fabrication, component purchasing, PCB
assembly, plastic injection molding, high volume metal stamping,
die-casting and custom fabrication.
Up to now, Xingchenger has over 500 employees based in China, with
well-trained staffs and professional working attitudes, we believe
our effective solutions can satisfy our customers’ needs through
manufacturing expertise and a culture of continuous improvement.
culture of continuous improvement.