Ask Lasest Price | |
Brand Name : | Chuangwei |
Model Number : | CWVC-5L |
Certification : | CE |
Price : | Negotiable |
Payment Terms : | T/T, Western Union, L/C |
Supply Ability : | 260 sets per month |
Delivery Time : | 7 days |
10W UV Optowave Laser PCB Separator Machine for Non Contact
Depaneling
PCB depaneling (singulation) laser machines and systems have been
gaining popularity over recent years. Mechanical
depanaling/singulation is done with routing, die cutting, and
dicing saw methods. However, as the boards get smaller, thinner,
flexible, and more sophisticated, those methods produce even more
exaggerated mechanical stress to the parts. Large boards with heavy
substrates absorb these stresses better, while these methods used
on ever-shrinking and complex boards can result in breakage. This
brings lower throughput, along with the added costs of tooling and
waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and
they also present challenges to the old methods. Delicate systems
reside on these boards and non-laser methods struggle to cut them
without damaging the sensitive circuitry. A non-contact depaneling
method is required and lasers provide a highly precise way of
singulation without any risk of harming them, regardless of
substrate.
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws
Lasers, on the other hand, are gaining control of the PCB
depaneling/singulation market due to higher precision, lower stress
on the parts, and higher throughput. Laser depaneling can be
applied to a variety of applications with a simple change in
settings. There is no bit or blade sharpening, lead time reordering
dies and parts, or cracked/broken edges due to torque on the
substrate. Application of lasers in PCB depaneling is dynamic and a
non-contact process.
Advantages of Laser PCB Depaneling/Singulation
Laser PCB Depaneling Specification
Laser class | 1 |
Max. working area (X x Y x Z) | 300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) | 300 mm x 300 mm |
Max. material size (X x Y) | 350 mm x 350 mm |
Data input formats | Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed | Depends on application |
Positioning accuracy | ± 25 μm (1 Mil) |
Diameter of focused laser beam | 20 μm (0.8 Mil) |
Laser wavelength | 355 nm |
System dimensions (W x H x D) | 1000mm*940mm *1520 mm |
Weight | ~ 450 kg (990 lbs) |
Operating conditions | |
Power supply | 230 VAC, 50-60 Hz, 3 kVA |
Cooling | Air-cooled (internal water-air cooling) |
Ambient temperature | 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil) |
Humidity | < 60 % (non-condensing) |
Required accessoires | Exhaust unit |
More information welcome to contact us:
Email/Skype: s5@smtfly.com
Mobile/Wechat/WhatsApp: +86-136-8490-4990
Company Info. |
Dongguan Chuangwei Electronic Equipment Manufactory |
Verified Supplier |
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