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... in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard? How to replace a new BGA chip...
... in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard? How to replace a new BGA chip...
IC removal! WDS580 repair computer laptop Wii ps4 xbox360 mobile repair soldering station bga rework station Product Description Technology Parameter: Item Specifications Total power 4800W Upper heating power 8...
power 220v WDS-520 with touch screen and Vacuum suction pen for ic chips remove mobiles repair machine Product Description WDS-520 Welding Soldering Machine IR Preheater lead-free Infrared Soldering Stations BG...
power 220v WDS-520 with touch screen and Vacuum suction pen for ic chips remove mobiles repair machine Product Description WDS-520 Welding Soldering Machine IR Preheater lead-free Infrared Soldering Stations BG...
...Process Printed Circuit Board Assembly Multi 10 Layer Pcb PCBA Technical Capabilities: Sercive PCB and SMT assembly with one-stop service Surface Finish HASL,ENIG,immersion silver,immersion tin,OSP… Componen...
...,ENIG,immersion silver,immersion tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal ...
... SMT,Thru-hole Solder Type Water Soluble Solder Paste,Leaded and Lead-Free Components Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Re...
... SMT,Thru-hole Solder Type Water Soluble Solder Paste,Leaded and Lead-Free Components Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Re...
... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days servic...
...Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service Max size...
... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days servic...
...Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service Max size...
Small Mobile Ic Chip Removal Machine WDS-580 For Iphone 5s Repair Product Description Specification: Total Power 4800W Upper Heating Power 800W Lower Heating Power 1200W Infrared Heating Power 2700W(1200W is co...
#detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box;padding-left:4px}#detail_decorate_root .magic-2{vertical...
#detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box;padding-left:4px}#detail_decorate_root .magic-2{vertical...
Small Mobile Ic Chip Removal Machine WDS-580 For Iphone 5s Repair Product Description Specification: Total Power 4800W Upper Heating Power 800W Lower Heating Power 1200W Infrared Heating Power 2700W(1200W is co...
#detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box;padding-left:4px}#detail_decorate_root .magic-2{vertical...
#detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box;padding-left:4px}#detail_decorate_root .magic-2{vertical...
... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BG...