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... algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera modu...
... is a kind of high-temperature resistant IC tray made of PES and the injection molding process. The JEDEC tray is a carrier used by semiconductor chip companies for packaging and baking tests of their chips....
...process technology: Arria V GX, GT, SX, and ST—28-nm low power (28LP) process Arria V GZ—28-nm high performance (28HP) process Lowest static power in its class (less than 1.2 W for 500K logic elements (LEs) ...
... versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components.YSLX-8200 is a powerful support too...
... system is effective for many applications in the PCB manufacturing process. This includes semiconductors such as BGA, CSP, LGA, POP, SIP, QFN, flip chips, COB, and LED. The YSL-9200 is a powerful support to...
... versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components.YSLX-8200 is a powerful support too...
... system is effective for many applications in the PCB manufacturing process. This includes semiconductors such as BGA, CSP, LGA, POP, SIP, QFN, flip chips, COB, and LED. The YSL-9200 is a powerful support to...