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... HDI,minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/4mil, impedance Ω±10%, Resin plug hole + copper fill hole Plate thickness: 0.60mm Product structure: FR-4, TG170, inner and ......
..., FR-4, TG170, inner and outer copper thickness 35um, hole copper 20um, impedance ±10%, plate thickness 3.20mm, Immersion gold 2u", SMT + plug-in + post-welding Printed circuit board (pcb) and PCBA products ...
...TG170, inner and outer copper thickness 35um, hole copper 20um, impedance ±10%, plate thickness 3.0mm, Immersion gold 2u", SMT + plug-in + post-welding Printed circuit board (pcb) and PCBA products Communica...
..., FR-4, TG150, inner and outer copper thickness 35um, hole copper 20um, impedance ±10%, plate thickness 3.50mm, Immersion gold 2u", SMT + plug-in + post-welding Printed circuit board (pcb) and PCBA products ...
... 50 Ohms, MCRF, PCB Vertical Socket, SMT, Mounting Height 1.25mm Features: Connector style : U.FL (UMCC) Connector type : socket, male insertion pin Contact Terminal : end welding Protective Terminal : end w...
...: male insertion pin Contact : end welding Protective: end welding Impedance: 50 ohms Mounting type : Surface Mount , through hole, right Angle The fastening type : thread Frequency - Maximum : 12.......
... may demand. Our expertise ranges from minimal layer PCBAs with basic thru-hole component population to 48 layer, hidden and stacked via, impedance controlled assemblies with the latest packages in LGA, BGA,...
... 18:01 Max Board Size 610mm*1100mm Min Width/Space 2.4/2.4mil Min Outline Tolerance ±0.1mm Impedance Tolerance ±5% Min PP Thickness 0.06mm Bow & Twist ≤0.5%...
4.0 Bluetooth PCB Assembly Tpa3116d2 Subwoofer Amplifier Board Product specification: Product name: bluetooth digital amplifier board Chip model: TPA3116D2 Bluetooth version: 4.0 Power supply voltage: 8-26V App...
...PCB Rogers Radio Frequency Quick details: Layer:2 Surface: ENIG Thickness:0.254mm Copper weight:1OZ Origin:China Material:Rogers RF Rogers printed circuit boards can provide a variety of benefits to the us...
FR4 UL 94v0 PCB Prototype With 1.6mm Impedance Control Customed Electronics Board Quick detail: Origin:China Special: FR4 Material Layer:2 Thickness:1.6mm Surface: ENIG Hole:0.5 Specification: FR - 4 epoxy glas...
... Products Smart Home Rigid Flexible PCB Board PCBA Manufacture Quality Control: 1. Engineering pretreatment before production 2. 100% E-test, 100% visual inspection 3. AOI inspection 4. High voltage test, im...
...Printed Circuit Board Rigid Flexible PCB Assembly Our standard of quality control 1. Engineering pretreatment before production 2. AOI inspection 3.100% E-test, 100% visual inspection 4. High voltage test, i...
... Fabrication Multilayer PCB Regarding to quality control: 1. Reliability test, insulating resistance test, ionic cleanliness testing 2. Complete AOI inspection 3. 100% E-test, 100% visual inspection 4. High ...
... to mix heavy copper with standard features on a single board, also known as PowerLink. Advantages include reduced layer count, low impedance power distribution, smaller footprints and potential cost savings...
...PCB Assembly Service with RoHs and Reach Advantages: • Strict product liability, taking IPC-A-610 standard • Engineering pretreatment before production • Production process control (5Ms) • 100% E-test, 100% ...
...Prototype leadtime of 5 to 10 working days (1-2 weeks) 4/Stack-ups and impedance simulation in 36 hours 5/Initial response to technical questions or quality concerns in 36 hours 6/DFM and EQ's prior to PO .....
...PCB Assembly Service with RoHs and Reach Advantages: • Strict product liability, taking IPC-A-610 standard • Engineering pretreatment before production • Production process control (5Ms) • 100% E-test, 100% ...
...Prototype leadtime of 5 to 10 working days (1-2 weeks) 4/Stack-ups and impedance simulation in 36 hours 5/Initial response to technical questions or quality concerns in 36 hours 6/DFM and EQ's prior to PO .....
... to mix heavy copper with standard features on a single board, also known as PowerLink. Advantages include reduced layer count, low impedance power distribution, smaller footprints and potential cost savings...