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...SMD 3030 3V/6V series 3 years warranty 15-160lm LM80 passed white color Details: Item name: 1-3W TYF SMD 3030 3V/6V series 3 years warranty 15-160lm LM80 passed white color Product type: SMD 3030 Voltage: 3/...
...SMD 3030 3V 320mA series 3 years warranty 15-160lm LM80 9000H passed Details: Item name: 1-3W TYF SMD 3030 3V 320mA series 3 years warranty 15-160lm LM80 9000H passed Product type: SMD 3030 Voltage: 3/6/9/18...
...SMD 3030 3V/6V/9V/18V series 3000K/4000K/5000K/6000K white color High Cri up to 95 Details: Item name: 1-3W SMD 3030 3V/6V/9V/18V series 3000K/4000K/5000K/6000K white color High Cri up to 95 Product type: SM...
...SMD 3030 3V/6V series 5 years warranty 15-160lm High CRI 90 for plant light Details: Item name: 1-3W SMD 3030 3V/6V series 5 years warranty 15-160lm High CRI 90 for plant light Product type: SMD 3030 Voltage...
High Speed SMD LED Chip Mounter LED SMT Assembly Machine Automatic Pick And Place Machine For LED Production With CE Beijing HuaweiGuochuang Electronic Technology Co. Ltd. is a Chinese high-tech enterprise with...
High Speed SMD LED Chip Mounter LED SMT Assembly Machine Automatic Pick And Place Machine For LED Production With CE Beijing HuaweiGuochuang Electronic Technology Co. Ltd. is a Chinese high-tech enterprise with...
3030 SMD LED High Bay Lens 90 Degree For Industrial LED Light Fixtures Lenses are designed for use with single or multiple LEDs. This includes LED modules or strips. LED lenses come in various shapes and sizes,...
PART NUMBER POWER CCT LUMINUOUS EFF Color Rendering Index IF VF WHOLE SIZE LN-SMD2835XW-P0.5-HXS 0.5W WW=2400-2700K CW=7000-7500K WW=20-25lm CW=25-27lm >90/95 60mA (Max=150mA) 2.7-3.4V 2.8*3.5MM LN-SMD5454XW-P0...
1313 Rgbcw Cob Led Chip Features Dimension 13.5mm×13.5mm×1.5mm Wide viewing angle : 120° RoHS compliant sulphation corrosion resistance Manual Soldering 1313 Rgbcw Cob Led Chip Details Product Name 1313 RGBCW C...
Product parameters INFRARED POWER Dominant Wavelength Optical Power IF VF Circuit WHOLE SIZE Lighting Area VIEW ANGLE LENS SUBSTRATE CHIPS Warranty LN-PLS8IR-PS2-EP45 2W*2 650-660nm 400-600mW 700mA 2.0-2.4V 1S1...
Application Introduction: the FPC material used is soft, it can be bent, folded and wound arbitrarily, and can move and expand freely in three-dimensional space to break; It is suitable for irregular places and...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Pixel 3.91mm Outdoor Fixed LED Display Epistar LED Chip Type 600~1200cd/M2 Product Description √ High precision die casting aluminum material cabinet, special design on cabinet bottom ......
Product parameters INFRARED POWER Dominant Wavelength Optical Power IF VF Circuit WHOLE SIZE Lighting Area VIEW ANGLE LENS SUBSTRATE CHIPS Warranty LN-PLS8IR-PS2-EP45 2W*2 650-660nm 400-600mW 700mA 2.0-2.4V 1S1...
Product parameters 100-200mW POWER Dominant Wavelength Optical Power IF VF Circuit WHOLE SIZE Lighting Area VIEW ANGLE LENS SUBSTRATE CHIPS Warranty LN-PLS8SB-P2-EP45 2W 470-480nm 950-1100mW 700mA 3.0-3.4V 1S1P...
Product parameters INFRARED POWER Dominant Wavelength Optical Power IF VF Circuit WHOLE SIZE Lighting Area VIEW ANGLE LENS SUBSTRATE CHIPS Warranty LN-SMD5050UYFIR-PF0.1-ES10 0.5w 840-850nm 30-50mW 30-60mA 1.6-...
High power 200W 250W SMD 3030 LED high quality with competitive price pcb chip for high bay light with CE, RoHS Product Information Product Item SMD 200W 250W PCB Chip Chip Matrial US Bridgelux Power 200W 250W ...
High power 200W 250W SMD 3030 LED high quality with competitive price pcb chip for high bay light with CE, RoHS Product Information Product Item SMD 200W 250W PCB Chip Chip Matrial US Bridgelux Power 200W 250W ...
...Smd Led Pixel Point Mesh Light For Media Screen Overview Quick Details Pixel Pitch: X: P5.21mm ; Y: P10.42mm Color: Full color Panel Size: 500*1000mm Applications: Stage,trade show,retail shop,indoor outdoor...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...