LPJ0012GDNL Networking Rj45 Modular Jack Cross Tab-Down Rj45
7499011121
7499011121 = MIC24011-0101T-LF3 Pin To PinLPJ0012GDNL
ELECTRICAL SPECFICATIONS @25℃
1.Turn Ratio(%%P2%):
TX=1CT:1CT RX=1CT:1CT
2.Inductance OCL: 350uH MIN
@ 100KHz/0.1V 8mA DC Bias
3.Insertion Loss:
1.0-100MHz:-1.0dB MAX
4.Return Loss(dB MIN):
1-30MHz: -18 30-60MHz:-15
60-80MHz: -12 80-100MHz:-10
5.Cross talk(dB MIN):
30MHz: -40 60MHz: -35
100MHz:-30
6.Common Mode Rejection(dB MIN):
30MHz: -40 60MHz: -35
100MHz:-30
7.Hipot Test: 1500Vrms
8.Operating Temperature Range: 0℃ TO 70℃
NOTES:
1.Designed to support application,such as SOHO(ADSL
modems),LAN-on-Motherboard(LOM),hub and Switches.
2.Connector Materials:
Housing: Thermoplastic PBT+30%G.F UL94V-0
Contact: Phosphor Bonze C5210R-EH Thickness=0.35mm
Pins: Brass C2680R-H Thickness=0.35mm
Shield: SUS 201-1/2H Thickness=0.2mm
Contact plating: Gold 6 micro-inches min.In contact area.
3.Wave solder tip temperature: 265℃ Max,5 Sec Max.
| Emitting Color | λp(nm) | VF@IF=20mA | IR @VR=5V |
| Green | 565 | 1.8~2.6V | 10μA max |
| Yellow | 590 | 1.8~2.6V | 10μA max |
Applications For Terminal User
Used for networking and communication equipments such as HUB, PC
card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways
setup,Border Gateway Protocol,fast ethernet switch ...
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics
,Cypress, Freescale,EKF.......
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
LINK-PP RJ45 Designed for BeagleBone Black of Texas Instrument
http://www.ti.com/tool/beaglebk#0
a low-cost, open source, community-supported development platform
for ARM® Cortex™-A8 processor developers and hobbyists.
LINK-PP ------------ The Appointed Supplier And Supporter Of
Embedded System for Ti
