Product Information |
Item | 30W RGBW LED COB CHIP |
Size | 36*36/28MM |
Current | White(300mA)+R(900mA)+G(900mA)+B(900mA) |
Voltage | 18-21V |
Wavelength | RED+BLUE+GREEN+WHITE |
Chip Brand | Epileds+Bridgelux |
Application | Flashlight/ Recessed Light
|
Warranty Spanlife
| 3 Years 50000 hours |
Electro Optical Characteristics
Product Code
| Nominal CCT
| CRI(Ra) | Luminous Flux | Chromaticity | Forward Current (mA) | Voltage (V) |
| | Ra | R9 | | X | Y | | |
| | Min. | Min. | Min. | Typ. | Max. | Typ. | Typ. | | Min. | Typ. | Max. |
| XCT3628-M0702-A4090-C31 | 4000K | 90 | 50 | 700 | 750 | 800 | 0.3814 | 0.3832 | 300 | 21 | 22.2 | 23 |
Product Code
| Nominal CCT
| CRI(Ra) | Luminous Flux | W.D | Forward Current (mA) | Voltage (V) |
| | Ra | R9 | | | | |
| | Min. | Min. | Min. | Typ. | Min. | Max. | | Min. | Typ. | Max. |
| R | / | / | / | 750 | 850 | 620 | 625 | 900 | 18 | 18.4 | 20 |
| G | / | / | / | 1500 | 1600 | 520 | 525 | 900 | 20 | 20.4 | 24 |
| B | / | / | / | 350 | 450 | 457 | 462 | 900 | 20 | 21 | 24 |
Mechanical Dimensions
Features
◆ Mechanical Dimensions 36.0*36.0*1.7(mm)
◆ Package Structure : Aluminium Base Chip on Board
◆ CRI(Ra): Min.90
◆ Nominal CCT :4,000K
◆ Chromaticity Range : 3-step MacAdam Ellipse
◆ RoHS compliant
◆ Better die arrangement for optics . Wide range of luminous
fluxand high efficacy
Absolute Maximum Ratings
| Parameter | Symbol | Rating |
| Forward Current | IF | 4000K-370mA,RGB-1300mA |
| Reverse Current | IR | 1mA |
| Operating Temperature | TOPR | -30℃ To +75℃ |
| Storage Temperature | Tst | -30℃ To +75℃ |
| Case Temperature | Tc | 85℃ |
| Junction Temperature | TJ | 125℃ |
| Soldering Temperature | TSOL | 350℃± 10℃ For 5 Seconds |
User Manuel
1. Storage
To avoid moisture, we recommend storage conditions for the unopened
LED +5 ~ +30℃ rela-tive humidity <60%. LED should be used within
168 Hrs. of opening the package. Please make sure to dehumidify and
vacuum pack the remaining/ unused LED. Dehumidifying condition:
+120℃±5℃ of 4Hrs. Effective age for the sealed led is one year.
2.The soldering precautions
Soldering conditions: Reflow soldering is not recommended for this
LED. If hand soldering, set sol-dering iron temperature at 350℃ and
soldering time not More than 3.5 seconds, after the first
soldering, make sure the substrate surface temperature returns to
ambient temperature before a second soldering. Please. make sure
when soldering, there is no external force on the soldering surface
and silicon batardeau (such as pressure, friction or sharp metal
nails, etc.), to avoid gold wire deformation or dam-age and other
abnormalities. If beyond recommended conditions, we cannot
guarantee the LED stability, please do the risk assessment first.
During assembly, please ensure that a good quality thermal paste is
applied and distributed evenly over the surface. While using
thermal pad (Heat Sink), make sure LED is firmly tightened and
there is no gap between surfaces. In such heat-media products,
through a pressure test of at least 500 volts.
3. Anti-Static Measures
Please take adequate measures to prevent electrostatic generation,
such as wearing electrostatic ring or anti-static fingerstall etc;
any relative products like plant equipment, machinery, carrier and
transpor-tation units shall be connected to discharging unit/
ground. The ESD sensitivity of this product is > 1000V(HBM),
after assembly the final lamp, please make sure to discharge Static
Electricity by proper ESD equipment.
4.Temperature Control
Recommended temperature conditions for enhanced product life: Be
sure to TS point (negative pads) controlled below 85℃, COB
recommendation colloid surface temperature control ≤150℃.
5.The drive control
Drive this product at constant current. Output current range
specifications should be ac-cording to the operational and other
conditions, as mentioned in data sheet. Before using a constant
voltage source or altered specifications other than recommended,
please consider risk factors.
Application
