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Semi automatic Ultrafast Laser Machine Ultraviolet Green Laser Cutting Machine

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Semi automatic Ultrafast Laser Machine Ultraviolet Green Laser Cutting Machine

Semi automatic Ultrafast Laser Machine Ultraviolet Green Laser Cutting Machine

Function Introduction
Inorder to satisfy the high precision manufacturing requirements of various thin-plate materials, applied in consumer electronics industry PCB/FPC, cover layer profile, camera module, and fingerprint packaging chip, the machine adopts multiparameter real-time monitoring system and adaptive closed-loop control technique, such as terminal facula, beam aiming, and laser power. In this way, this machine is capable of providing solutions of simple, fast, non-consumable, contactless, high-accuracy, and arbitrarily shaped lineation, half dicing, cutting, and ablation.

Main Specification

Model
MU-450/500
Processing wide400mmx550mm/650mmx500mm
Platform positioning accuracy≤±3μm
The identification accuracy4μm/1μm
Platform velocity1000mm/s
Optimum cutting thickness1mm/2mm

Features

1 Equipped with high-performance and high accuracy scanning mirror, and high accuracy linear motor working platform;
2 CCD automatic positioning, and automatic correction software;
3 Real time feedback in software interface;
4 High-efficiency dust proofing to effectively reduce the cleaning and maintenance time of equipment.


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