Empowering Innovation Discover Excellence at Our Advanced PCB
Factory
PCB Manufacturing Introduction:
Embark on a transformative journey of innovation at our
cutting-edge PCB factory. We're not just a manufacturer; we're your
partners in pushing the boundaries of electronics. Our extensive
range of insulation materials, versatile layer options, and
meticulous finishes lay the foundation for your most ambitious
designs. Whether you require robust copper foil solutions,
intricate multi-layer configurations, or specialized processes for
high-frequency applications, we stand ready to meet your demands.
With a commitment to exceptional materials, advanced technology,
and stringent quality standards, our factory ensures that your
vision becomes the reality of remarkable functionality and
durability. Join us in revolutionizing electronics – where
possibilities know no bounds.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very
difficult to flatten very thin pads, which brings difficulty to SMT
placement. In addition, the shelf life of the HASL is very short,
and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold
process is to deposit a nickel-gold coating with stable color, good
brightness, flat coating and good solderability on the surface of
the printed circuit board. Basically, it can be divided into four
stages: pre-treatment (oil extraction, micro-etching, activation,
post-immersion), nickel immersion, gold immersion, and
post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than
lead-free, the specific amount depends on the composition of the
lead-free alloy, such as the total gold of SNAGCU 217 degrees, the
soldering temperature is the eutectic immersion plus 30 degrees or
50 degrees, It depends on the actual adjustment, the lead eutectic
is 183 degrees, the mechanical strength, brightness, etc. are
better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in
the soldering process, lead-tin wire is better than lead-free tin
wire, but lead is poisonous, long-term use is not good for human
health, and lead-free tin will It is brighter than lead-tin
melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock
resistance, and corrosion resistance. It is used to protect the
copper surface from rusting (oxidation or carbonization) in a
normal environment: but in the subsequent welding high temperature,
this protection The film must be easily removed quickly by the flux
so that the exposed clean copper surface can be melted and soldered
immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing
R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over
95%
4. Excellent materials, advanced equipment, and strict quality
system 5. Exclusive customer service one-to-one service, seamless
connection throughout the process
