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2-64 layers PCB Manufacturing And Assembly ISO / UL Certifiction

    Buy cheap 2-64 layers PCB Manufacturing And Assembly ISO / UL Certifiction from wholesalers
     
    Buy cheap 2-64 layers PCB Manufacturing And Assembly ISO / UL Certifiction from wholesalers
    • Buy cheap 2-64 layers PCB Manufacturing And Assembly ISO / UL Certifiction from wholesalers

    2-64 layers PCB Manufacturing And Assembly ISO / UL Certifiction

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    Brand Name : CUSTOM MADE
    Certification : ISO/UL
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 100000pc/Month
    Delivery Time : 4 Weeks
    • Product Details
    • Company Profile

    2-64 layers PCB Manufacturing And Assembly ISO / UL Certifiction

    Advanced PCB Manufacturing with Diverse Specifications


    PCB Manufacturing Introduction:
    Experience the pinnacle of PCB manufacturing versatility. Our factory offers insulation materials including FR4, aluminum, copper, ceramic, PI, and PET, along with various copper foil options such as glueless rolled copper and glued electrolytic copper. With board layers ranging from 1 to 12, we ensure precision in finished plate thickness (0.07MM and above) and inner layer copper thickness (18-70UM), catering to various design needs.

    Explore a broad array of surface treatments, from anti-oxidation to immersion gold and more, as well as specialized processes like impedance control and high-frequency plate production. Our products boast adherence to strict tolerances, including solder resist ring width, solder bridge width, solder mask window, and aperture specifications.

    Our PCBs are reinforced with materials like Pl, FR4, steel sheet, M glue, and electromagnetic shielding film, offering the utmost durability and reliability. Unleash innovation within a maximum size of 50OMM"100OMM, while our advanced forming methods like V-cut, CNC, and punching ensure precision in shaping.

    Shape the future with PCBs that offer enhanced performance and design freedom.


    PCB Manufacturing Parameters:

    ItemTechnical Parameter
    Layer2-64
    Thickness0.3-6.5mm
    Copper Thickness0.3-12 oz
    Min Mechanical Hole0.1mm
    Min Laser Hole0.075mm
    HDI1+n+1,2+n+2,3+n+3
    Max Aspect Ratio20:01
    Max Board Size650mm*1130mm
    Min Width/Space2.4/2.4mil
    Min Outline Tolerance±0.1mm
    Impedance Tolerance±5%
    Min PP Thickness0.06mm
    Bow &Twist≤0.5%
    MaterialsFR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
    Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
    Special CapabilityGold Finger Plating, Peelable, Carbon ink

    PCB Manufacturing Process:

    1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.

    2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)


    3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.

    4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.

    5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.


    PCB Manufacturing Advantages:

    1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.

    2. Quick quotation and quick response.

    3. The delivery date is fast, and the on-time delivery rate is over 95%

    4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process


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