Advanced PCB Manufacturing with Diverse Materials and Precision
Processes
PCB Manufacturing Introduction:
Explore our cutting-edge PCB factory, specializing in 1 to 12-layer
boards. Our wide range of insulation materials includes FR4,
aluminum, copper, ceramic, PI, and PET. With finished plate
thickness starting at 0.07mm and above (tolerance +5%/-6%), our
boards offer exceptional quality and performance.
Benefit from inner layer copper thickness options ranging from
18-70μm and outer layer copper thickness from 20-140μm. Choose from
an array of solder-resist colors and letters including red, green,
yellow, blue, white, black, and silver, and experience surface
treatments such as anti-oxidation, HASL, immersion gold, and more.
Our PCBs undergo special processes like thick copper plating,
impedance control, high-frequency capabilities, and single-layer
copper foil gold finger plates with unique configurations.
Reinforcement options include Pl, FR4, steel sheet, M glue, and
electromagnetic shielding film.
With a maximum size of 50mm x 100mm, our boards offer precision
with outer/inner line width and spacing of 0.065mm/3mil. We ensure
meticulous attention to detail with minimum solder resist ring
width, solder bridge width, solder mask window, and aperture
requirements.
Our products maintain impedance tolerance at 10%, adhering to shape
tolerances of +0.05mm G laser +0.005mm. Choose from forming methods
such as V-cut, CNC, and punching to achieve the desired
specifications. Experience the future of PCB manufacturing with our
advanced solutions.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very
difficult to flatten very thin pads, which brings difficulty to SMT
placement. In addition, the shelf life of the HASL is very short,
and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold
process is to deposit a nickel-gold coating with stable color, good
brightness, flat coating and good solderability on the surface of
the printed circuit board. Basically, it can be divided into four
stages: pre-treatment (oil extraction, micro-etching, activation,
post-immersion), nickel immersion, gold immersion, and
post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than
lead-free, the specific amount depends on the composition of the
lead-free alloy, such as the total gold of SNAGCU 217 degrees, the
soldering temperature is the eutectic immersion plus 30 degrees or
50 degrees, It depends on the actual adjustment, the lead eutectic
is 183 degrees, the mechanical strength, brightness, etc. are
better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in
the soldering process, lead-tin wire is better than lead-free tin
wire, but lead is poisonous, long-term use is not good for human
health, and lead-free tin will It is brighter than lead-tin
melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock
resistance, and corrosion resistance. It is used to protect the
copper surface from rusting (oxidation or carbonization) in a
normal environment: but in the subsequent welding high temperature,
this protection The film must be easily removed quickly by the flux
so that the exposed clean copper surface can be melted and soldered
immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing
R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over
95%
4. Excellent materials, advanced equipment, and strict quality
system 5. Exclusive customer service one-to-one service, seamless
connection throughout the process
