Advanced PCB Manufacturing: Precision and Diversity
PCB Manufacturing Introduction:
Experience the future of PCBs with our state-of-the-art
manufacturing solutions. Choose from a variety of insulation
materials including FR4, aluminum, copper, ceramic, PI, and PET,
and create boards ranging from 1 to 12 layers. Our offerings
feature finished plate thicknesses of 0.07mm and above, ensuring
exceptional precision with a tolerance of +5%/-6%. The inner layer
copper thickness spans from 18-70μm, while the outer layer
showcases 20-140μm, ensuring reliable performance.
Embrace design flexibility with an array of solder-resistance
colors and lettering options. Elevate your projects with surface
treatments like anti-oxidation, HASL, immersion gold, gold-plated,
silver-plated, carbon oil, and more. Explore advanced processes
such as thick copper plating, impedance control, high-frequency,
and specialized half-hole orifice and hollow plates. Reinforce your
designs with materials like FR4, steel, or electromagnetic
shielding film.
Achieve precision in a compact size of 50mm x 100mm, maintaining
fine outer and inner line width and spacing of 0.065mm/3mil. Our
products adhere to strict minimum dimensions, including solder
resist ring width, solder bridge width, solder mask window, and
aperture requirements. Expect impedance tolerance of up to 10% and
shape tolerance of +0.05mm with laser precision of +0.005mm.
Craft your designs through forming methods like V-cut, CNC, and
punching, offering versatile fabrication possibilities. Join us in
shaping the electronics landscape with our cutting-edge PCB
solutions.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very
difficult to flatten very thin pads, which brings difficulty to SMT
placement. In addition, the shelf life of the HASL is very short,
and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold
process is to deposit a nickel-gold coating with stable color, good
brightness, flat coating and good solderability on the surface of
the printed circuit board. Basically, it can be divided into four
stages: pre-treatment (oil extraction, micro-etching, activation,
post-immersion), nickel immersion, gold immersion, and
post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than
lead-free, the specific amount depends on the composition of the
lead-free alloy, such as the total gold of SNAGCU 217 degrees, the
soldering temperature is the eutectic immersion plus 30 degrees or
50 degrees, It depends on the actual adjustment, the lead eutectic
is 183 degrees, the mechanical strength, brightness, etc. are
better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in
the soldering process, lead-tin wire is better than lead-free tin
wire, but lead is poisonous, long-term use is not good for human
health, and lead-free tin will It is brighter than lead-tin
melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock
resistance, and corrosion resistance. It is used to protect the
copper surface from rusting (oxidation or carbonization) in a
normal environment: but in the subsequent welding high temperature,
this protection The film must be easily removed quickly by the flux
so that the exposed clean copper surface can be melted and soldered
immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing
R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over
95%
4. Excellent materials, advanced equipment, and strict quality
system 5. Exclusive customer service one-to-one service, seamless
connection throughout the process
