Polyamide Hot-melt Adhesive/Hemming Adhesive (DY-P403)
1.Appearance:
Yellowish round grain with schistose shape
2.Property:
DY-P403 is a general type of polyamide hot-melt adhesive, which is made from dimer acid and polyamine through condensation reaction
at high temperature.
It can dissolve in general organic solvents, the hot-melting
viscosity of the resin is greatly related to the temperature that
it gets.
The polyamide hot-melt adhesive possesses the following advantages,
such as lower viscosity, good fluidity, good flexibility, high
adhesive strength, good media corrosion resistance, good solubility
and fluxing property at low temperature, higher heat stability etc.
3.Application
This type of resin is applied in heat-shrinkable sleeve for
electric cable, sealing material for electrical connection,
cementing or fixing materials for electronic component, bonding
material for package, textile, leather, wood, plastic, metal and
ceramics etc.
4.Technologic Index
| Acid Value,(mg KOH/g ≤) | 5 |
| Amine Value,(mg KOH/g≤) | 3 |
| Viscosity,(mpa.s/200ºC) | 4000-6000 |
| Softening Point,(ºC) | 160±5 |
| Color,(Fe-Co ≤) | 8 |
| Tensile Strength, (≥ MPa) | 13 |
| Water absorption, (≤ %) | 0.4 |
| Shear Strength, (≥ MPa, AL/AL) | 10 |
| Stretch Rate, (≥ %) | 250 |
Peeling strength, (≥ N/25mm,PE/PE,60±2ºC) | 100 |
| Operating Temperature( ºC ) | 190-200 |
5.Packaging & Storage
Double packing: paper-plastic composite bag lined with PE film.
Net weight: 25Kgs per bag.
Stored in cool, airy and dry place, the package has to be sealed
before using up the resins.
