Moldability for complex parts 1.0mmT silicone pads for Heat pipe
thermal solutions
The TIF140-40-11US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
TIF100-40-11US-Series-Datasheet.pdf
Features
> Good thermal conductive: 4.0 W/mK
>Thickness:1.0mmT
>hardness:20 shore 00
>Colour: Gray
>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
Typical Properties of TIF140-40-11US Series |
Color | gray | Visual | Composite Thickness | Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 |
Denisty | 3.15g/cm3 | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 |
| Thickness | 1.0mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 |
Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 |
| Outgasing (TML) | 0.40% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 |
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 |
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 |
Volume Resistivity | 6.0X1012
Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 |
Fire rating | 94 V0 | equivalent
UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 |
Thermal conductivity | 4.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ:
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
