PS21563-P Integrated Circuit IC Chip IGBT 3 Phase 600V 10A 35 Power DIP Driver Module

PS21563-P Power Driver Module IGBT 3 Phase 600V 10A 35-PowerDIP Module

Feature

• Employing 5th generation planar IGBT chips with 0.6µm design rule

or CSTBT™ technology with superior loss performance

• Ultra compact dual or single-in-line transfer mold package

(compatible with 2nd generation)

• Including driver and protection circuitry (UV, SC)

• DIP-IPM with reduction of thermal resistance by 20%

• 2500Vrms isolation voltage

• High-active interface logic for direct connection to a 3V or 5V MCU

• Highest reliability and optimised EMI performance

• Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW

• Optional with open emitter topology for vector control

• All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals

• From January 2006 onwards, all DIP and Mini-DIP-IPMs will

be supplied with completely lead-free technology

Koben Electronics was founded in 1995 and is located in the Silicon Valley of China, Shenzhen. 

The mission of Koben has always been to provide quality electronics components to manufacturers worldwide. Early on we became a primary conduit for end-of-program and overstock inventory for major distributors such as Future Electronics and contract manufacturers as Flextronics. Koben has since then added sourcing of high quality components from local manufacturers in China.

Koben has always been customer driven rather than opportunity driven. Meaning- we will always choose path that is best for long term relationship with customer over short term view. It is why we have one of the highest customer retention scores of China based distributors.