SSD PCB Solid State Drive Printed Circuit Board
PCB Specifications:
Part NO: SSDPCB00010
Layer Count: 8 Layer Printed Circuit Board
Finished Board Thickness: 0.9mm +/-0.05mm
Copper Thickness: 1/H/H/H/H//H/H1
Min Lind Space&Width: 3/3mil
Application Area: SSD(Solid State Drive)
Our Product Categories:
1 FR4 substrate PCB : 2 Layer Printed Circuit Board, 4 Layer PCB, 6
Layer PCB, 8 Layer PCB, 10 Layer PCB, 12 Layer PCB, 14 Layer PCB,
16 Layer PCB, 18 Layer PCB, 20 Layer PCB, 22 Layer PCB, 24 Layer
PCB, HDI PCB, High frequency PCB.
2 Aluminum Substrate pcb: 1 Layer Aluminum PCB, 2 Layer Aluminum
PCB, 4 Layer Aluminum PCB.
3 Flexible PCB: 1 Layer FPC, 2 Layer FPC, 4 Layer FPC, 6 Layer FPC
4 Rigid-Flex PCB: 2 Layer Rigid-Flex PCB, 4 Layer Rigid-Flex PCB, 6
Layer Rigid-Flex pcb, 8 Layer Rigid-Flex PCB, 10 Layer Rigid-Flex
pcb
5 Ceramic substrate pcb: single Layer Ceramic pcb, 2 layer ceramic
pcb
FAQ:
Q:Thermoset and Thermoplastic PCB Materials
A:
High-temperature processing comes into play during the
manufacturing of the high-frequency PCB boards. It starts with the
lamination of prepreg on the dielectric substrate followed by
adding the circuit layer. Heat-processing is the primary source to
combine all these layers together to form a well-defined board.
Thermoplastic and Thermoset materials are generally used for the
dielectric layers in PCBs or as adhesives in manufacturing circuit
laminates. These materials have their own strengths and weaknesses.
A Thermoplastic material is also called thermo-softening plastic.
It is a polymer, which converts to liquid when heated and attains a
glassy hard state when cooled.
Characteristics of Thermoplastic Material
- Processed at elevated temperatures
- Originally, available in rigid/ hard form, but softens when the
temperature increases towards its melting point.
- These materials can be reinforced with fillers, such as woven glass
or ceramic materials.
- Polytetrafluoroethylene (PTFE) is one of the best-known
thermoplastic material and it is often reinforced with some filler.
- They provide good electrical performance, but require complex
processing procedures.
- Less electrical loss with less change in electrical performance
over time.
Issues associated with Thermoplastic Material: Their processing is
difficult due to their high CTE value.
Thermoset is also called thermosetting plastic. It is also a
polymer material that is cured by applying heat (above 200
centigrade) through a chemical reaction. Before curing, this
material is in liquid or malleable form.
Characteristics of Thermoset Material
- Processed at elevated temperatures
- They achieve their hard state due to a thermochemical reaction.
Such a reaction hardens two components when they are mixed
together.
- Once hardened, they are harder than thermoplastic materials.
- Their CTE value is close to the CTE value of Copper, which is
suitable for standard processing procedures.
- Prone to more electrical loss
- These materials oxidized over time, result in changes of a PCB’s
dielectric constant (Dk) and dissipation factor (Df), which is
eventually responsible for PCB’s change in performance at RF/
microwave frequencies.
Issues associated with Thermoset Material
- Once hardened through a thermochemical reaction, thermoset material
cannot be re-melted back to their original state.
- Their electrical performance is not good as compared to
thermoplastics, but can be processed easily.
The characteristics of both thermoplastic and thermoset materials
can be improved with the choice of accurate filler material. This
choice of filler material greatly impacts their electrical
performance levels.
Contact US:
Steven YU
Email: yuhq@witgain.com
Skype: pcbproducer
