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30 Mil RO4730 Laminates High Frequency PCB 2 Layer

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30 Mil RO4730 Laminates High Frequency PCB 2 Layer

Rogers' RO4730G3 high frequency laminates are a dependable choice for antenna-grade printed circuit board substrates, offering a cost-effective alternative to traditional PTFE-based antenna substrates while enabling designers to fine-tune cost and performance. With a dielectric constant of 3 and a loss tangent of 0.0028 at 10 GHz, it also boasts a low thermal coefficient of dielectric constant (TCDk) of only 34 ppm/°C across a temperature range of -50°C to 150°C. Additionally, these high frequency PCBs have demonstrated low PIM performance, with a value of -165 dBc. The CTE values on both the X and Y axes are similar to that of copper, and the Z-axis CTE is impressively low at 30.3 ppm/°C. This superb CTE match significantly reduces stresses in the PCB antennas.



PropertyRO4730G3DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.5Z10 GHz 23℃IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign2.98Z1.7 GHz to 5 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0028Z10 GHz 23℃IPC-TM-650 2.5.5.5
2.5 GHz
Thermal Coefficient of ε+34Zppm/℃-50 ℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability<0.4X, Ymm/mafter etech +E2/150 ℃IPC-TM-650 2.4.39A
Volume Resistivity (0.030")9 X 107MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity (0.030")7.2 X 105COND AIPC-TM-650 2.5.17.1
PIM-165dBc50 ohm 0.060"43 dBm 1900 MHz
Electrical Strength (0.030")730ZV/milIPC-TM-650 2.5.6.2
Flexural Strength MD181 (26.3)Mpa (kpsi)RTASTM D790
CMD139 (20.2)
Moisure Absorption0.093-%48/50IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity0.45ZW/mK50℃ASTM D5470
Coefficient of Thermal Expansion15.9
14.4
35.2
X
Y
Z
ppm/℃-50 ℃to 288℃IPC-TM-650 2.4.4.1
Tg>280IPC-TM-650 2.4.24
Td411ASTM D3850
Density1.58gm/cm3ASTM D792
Copper Peel Stength4.1pli1oz,LoPro EDCIPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

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