good performance ultra soft heat sink pad for Audio and video
components ,4.0mmT,18 Shore 00,TIF1160-18-01US
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too
much heat affecting its high performance when using. Plus thermal
products can control and manage heat to keep it cool to some
extent.
TIF100-18-01US-Specification-sheet.pdf
TIF1160-18-01US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
Features
<Good thermal conductive:1.8W/mK
<Thickness:4.0mmT
<Hardness:18 Shore 00
<Colour: black
<RoHS compliant
<Outstanding thermal performance
<Fiberglass reinforced for puncture, shear and tear resistance
Applications
<CPU
<display card
<mainboard/mother board
<Set top boxes
<Audio and video components
<IT infrastructure
<GPS navigation and other portable devices
Typical Properties of TIF1160-18-01US |
Product Name | TIF1160-18-01US Series |
Colour | black |
Construction & Compostion | Ceramic filled silicone elastomer |
Specific gravity | 2.5 g/cc |
Thickness | 4.0mmT |
Hardness | 18 Shore 00 |
Dielectric constant@1MHz | 4.5 MHz |
Continuos Use Temp | -40to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 1.8 W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
