Condition for Reflow
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA(K) or CC(T) at solder joints (copper
foil surface). A heat resisting tape
should be used for fix measurement.
3. Temperature profile
(1) The above temperature shall be measured of the top of switch.
There are cases where PC board's temperature greatly differs from
that of the switch, depending on the material, size, thickness of
PC board's and others. Care, should be taken to prevent the
switch's surface temperature from exceeding 260°C.
(2) Soldering conditions differ depending on reflow soldering
machines. Prior verification of soldering condition is highly
recommended.
Manual Soldering
| Items | Condition |
| Soldering temperature | 350°C max. |
| Duration of soldering | 3s max. |
| Capacity of soldering iron | 60W max. |
1. Consult with us for availability of TACT switch washing.
2. Prevent flux penetration from the top side of the TACT switch.
3. Switch terminals and a PC board should not be coated with flux
prior to soldering.
4. The second soldering should be done after the switch returns to
normal temperature.
5. Use the flux with a specific gravity of min.0.81
Use Notes:
1. Terminals to carry our welding, if the load imposed on the
terminal, it may be relaxed, deformation and deterioration of the
electrical characterisics due to the different conditions, please note that when in use
2. The use of through holes brushes circuit board and other recommended board, due to the heart stress of change, so please
pre-conditions on the welding and full recognition.
3. Welding on the set of conditions needed to confirm the actual
conditions of mass production.
