Condition for Reflow
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA(K) or CC(T) at solder joints (copper
foil surface). A heat resisting tape
should be used for fix measurement.
3. Temperature profile
(1) The above temperature shall be measured of the top of switch.
There are cases where PC board's temperature greatly differs from
that of the switch, depending on the material, size, thickness of
PC board's and others. Care, should be taken to prevent the
switch's surface temperature from exceeding 260°C.
(2) Soldering conditions differ depending on reflow soldering
machines. Prior verification of soldering condition is highly
recommended.
Attention:
1.It is suggest to use more than 3% scaling powder of solder paste,
avoid the soldering flux entering the switch so that the switch is
invalid.
2.when designing the press handle, please refer to the drawing
provided, do not press the switch directly with a sharp object, and
the handle needs to be pressed vertically at the center of the
switch, and press the handle to press the system at ±3°.
3.switch welding process, should pay special attention to the
temperature and time control at 255±2℃,not more than 5 second.
otherwise the temperature is too high,it will affect the switch
life.
4.when welding, the switch should be kept OFF to avoid the switch
from being damaged.
