4.5mmT,20±5 Shore 00 Good performance thermal conductive pad for
Automotive engine control units,
The TIF1180-30-11US is recommended for applications that require a minimum amount of
pressure on components. The viscoelastic nature of the material
also gives excellent low-stress vibration dampening and shock
absorbing characteristics. TIF1180-30-11US is an electrically isolating material, which allows its use in
applications requiring isolation between heat sinks and
high-voltage, bare-leaded devices.
TIF100-30-11US-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:4.5mmT
>hardness:20±5 shore00
>Colour: gray
>Moldability for complex parts
>Outstanding thermal performance
>Electrically isolating
>High durability
Applications
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>IT infrastructure
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
Typical Properties of TIF1180-30-11US Series |
Color | gray | Visual | Composite Thickness | Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 |
Specific gravity | 3.0g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 |
| Thickness | 4.5mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 |
Hardness | 20±5 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 |
Outgassing(TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 |
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 |
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 |
Volume Resistivity | 1.0X1012
Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 |
Fire rating | 94 V0 | equivalent
UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 |
Thermal conductivity | 3.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
With professional R&D capabilities and over 13 year experiences
in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages.
Our goal is to provide quality & competitive products to our
customers worldwide aiming for long-term business cooperation.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us
email for inquiry.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
