5.0mmT 2.9 g/cc silicone sheets with outstanding thermal
performance for power supply heat sinking
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are
extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2
products, CD-ROM ,LCD TV, PDP products, Server Power products, Down
lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power
products and others.
TIF100-30-11ES-Datasheet-REV02.pdf
TIF1200-30-11ES use a special process, with silicone as the base material, adding
thermal conductive powder and flame retardant together to make the
mixture to become thermal interface material. This is effective in
lower the thermal resistance between the heat source and the heat
sink.
Features
<Good thermal conductive:3.0W/mK
<Thickness:5.0mmT
<Hardness:12 Shore 00
<Colour: gray
<Moldability for complex parts
<High tack surface reduces contact resistance
<Fiberglass reinforced for puncture, shear and tear resistance
Applications
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
<IT infrastructure
<GPS navigation and other portable devices
<CD-Rom, DVD-Rom cooling
Typical Properties of TIF1200-30-11ES |
Product Name | TIF1200-30-11ES Series |
Colour | gray |
Construction & Compostion | Ceramic filled silicone elastomer |
Specific gravity | 2.9 g/cc |
Thickness | 5.0mmT |
Hardness | 12 Shore 00 |
Dielectric constant@1MHz | 4.0 MHz |
Continuos Use Temp | -40to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 3.0W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Advantage
Ziitek has independent R&D team. This team is experience,
rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek
thermal conductive materials. With well-equipped testing equipment,
we Ziitek can also do some tests with customers' samples, so we can
find a more suitable Ziitek materials for every customer.
FAQ
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
