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| Brand Name : | XILINX / AMD | 
| Model Number : | XC7S75-1FGGA676I | 
| Price : | Negotiable | 
| Payment Terms : | L/C, D/A, D/P, T/T, Western Union, MoneyGram | 
| Supply Ability : | 999999 | 
| Delivery Time : | 1-3 days | 
XC7S75-1FGGA676I Programmable IC Chip High Performance and Reliability Package 676-FPBGA
| Number of LABs/CLBs | 6000 | |
| Number of Logic Elements/Cells | 76800 | |
| Total RAM Bits | 4331520 | |
| Number of I/O | 400 | |
| Voltage - Supply | 0.95V ~ 1.05V | |
| Mounting Type | ||
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | ||
| Supplier Device Package | 676-FPBGA (27x27) | 
Product: XC7S75-1FGGA676I Programmable IC Chip
Specifications:
- Family: Spartan-7
- Device: XC7S75
- Speed Grade: -1
- Package: FGGA676
- I/O Pins: 676
- Logic Cells: 73,440
- Slices: 11,520
- Block RAM: 3,060 Kb
- DSP Slices: 120
- Clock Management Tiles: 6
- Total RAM Bits: 3,129,600
- Operating Voltage: 1.2V
- Operating Temperature: -40°C to +100°C
Features:
- High-performance, low-power FPGA (Field-Programmable Gate Array)
- Designed for cost-effective and power-sensitive applications
- Industry-standard 1.2V core voltage for efficient power
consumption
- Extensive logic capacity with 73,440 logic cells
- Abundant I/O pins (676) for versatile connectivity options
- Integrated memory blocks (3,060 Kb) for efficient data storage
- DSP resources (120 slices) for digital signal processing
- Advanced clock management tiles (6) for precise timing control
- Wide operating temperature range for various environments
- Supports advanced design methodologies and tool flows
Package Details:
- Package Type: FGGA676
- Pin Count: 676
- Pin Pitch: 0.8mm
- Package Dimensions: 27mm x 27mm

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