Aluminum base copper-clad laminate has excellent flame retardant,
high mechanical strength, dimensional stability, etc. Especially it
has a very good heat sink, electromagnetic shielding, and solder
float.
It's widely used for the modifier and sparker on fire for
motorcycle and mobile, power LED, sound box, power supply module,
and acoustics shielding system, etc.
Note: We specially produce Metal Base Copper-Clad Laminates, and
our products have been compiled series with all complete
specifications.
The tapy and specification of Aluminum-based Laminates CCAF-01,
CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42")
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base
copper-clad laminate
The thickness of the copper: 35um
The thickness of the dielectric: 70um
The thickness of the aluminum base: 1.5mm
The result of the test:
Technique parameter:
| Item | Test item | Technology request | Unit | Test result |
|
| 1 | Peel Strength | A | ≥ 1.8 | N/mm | 2 |
|
| After thermal stress (260ordm;C) | ≥ 1.8 | N/mm | 1.8 |
|
| 2 | Blister test AfterThermal stress (260ºC, 2min ) | No delaminating | / | Ok |
|
| 3 | Flammability(A) | FV-O | / | FV-O |
|
| 4 | Thermal resistance | ≤ 2.0 | ordm;C /W | 1 |
|
| 5 | Surface Resistivity | A | ≥ 1 × 10 5 | M Ω | 5 × 10 7 |
|
| Constant humidity treatment | ≥ 1 × 10 5 | M Ω | 2 × 10 6 |
| (90%,3 5 ordm;C,96h) |
|
| 6 | Volume Resistivity | A | ≥ 1 × 10 6 | M Ω· m | 4 × 10 8 |
|
| Constant humidity treatment | ≥ 1 × 10 6 | M Ω· m | 5 × 10 7 |
| (90%,3 5ordm;C ,96h) |
|
| 7 | Dielectric Breakdown ( DC ) | ≥ 28.5 | Kv/mm | 31 |
|
| 8 | Dielectric constant (1MHz ) | ≤ 4.4 | / | 4.2 |
| (40 ordm;C,93% , 96h ) |
|
| 9 | Dielectric dissipation factor (1MHz ) | ≤ 0.03 | / | 0.02 |
| (40 ordm;C, 93% ,96h ) |
|
