Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board

Name: Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board
Brand: Yizhuo
Price: 1 USD

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Aluminum Base PCB Gold Plated 2oz Copper Printed Circuit Board

PCB PRODUCTION CAPACITY

PCB layers	1-layer to 10-layer(including HDI board)
Finish type	Gold-plated,Immersion gold-plated, HAL finish , Flux., Carbon -bridge, Entek, Nickel plating
Base material	FR4,CEM-1,CEM-3,FR1,FR2, Aluminium metal substrate and Rogers
Base material thickness	0.4-2.4mm.
Copper foil thickness	18um(H/HOZ) ,35um(1/1OZ) ,70um(2/2OZ), 5OZ
Maximum-product board	500700mm. For AL PCB: 5001400mm
Minimum drilled hole size	0.075mm
Minimum track width/spacing	3mil
Average hole wall copper	Thickness for HAL board: ≥25um.Gold-finger plating: ≥0.1um
Solder mask ink	Photo cure ink, heat cure ink. UV ink
Outline tolerance	±0.1mm
Hole diameter tolerance/ Hole location tolerance	±0.076mm/±0.076mm
V-CUT tolerance	±0.1mm.
Warp	According to the IPC-600F standard
lead time	Single-sided: 2-3 working days; Double-sided: 3-4 working days; Multi-layer: 8-10 working days

PCBA MANUFACTURING CAPABILITY

PCB assembly Layers	1 Layer to 36 layers (standard),
PCB assembly material/type	FR4, Aluminum, CEM1, Super-thin PCB, FPC/Gold finger
PCB Assembly service type	DIP/SMT or Mixed SMT & DIP
Copper thickness	0.5um-4um
Assembly surface finish	HASL,ENIG,OSP
PCB Dimension	600x1200mm
IC Pitch(min)	0.2mm
Chip Size(min)	01005
Leg distance(min)	0.3mm
PCB BGA Size	8x6mm~55x55mm
IC Encapsulation type	SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia.	0.2mm
Required Docs for PCBA	Gerber file with BOM list & Pick-N-Place File(XYRS)
SMT speed	CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs

Product Tags:

copper plated pcb board

Company Info.

Shenzhen Yizhuo Electronics Co., Ltd

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