JUNHE-2529 Diamond Wire Cutting Fluid is a new type of product, it is mainly used for cutting process of
all kinds of hard brittle materials(monocrystalline silicon,
polycrystalline silicon, germanium, gallium arsenide, quartz,
indium gallium nitride, gems, non-metallic materials, etc.), the
features of excellent lubrication,coo ling,corrosion
resistance,rust resistance and hydrogen inhibition function. The
silicon surface TTV after cutting is small without wire mark and
can prolong the life of diamond wire.
Product Features:
1. Two different components,add the defoamer at any proportion
according to different cutting machine.
2. Excellent lubrication, which can effectively prevent the silicon
in the process of cutting brittle cracks or scratches, reduce the
warp of silicon wafer surface roughness and surface, To minimize
the total thickness deviation deviation of silicon wafers.
3. Less foam,easy to use.
4. Unique suspension property,avoid silicon powder deposition block
machine pipeline.
Technical parameters:
| Appearance | Colorless clear liquid |
| Density(20℃,kg/L) | 0.98±0.05 |
| PH(0.2%) | 6.0~7.2 |
| Viscosity(40℃) | 120.0~180.0 |
Application method:
This product use concentration from 0.2% to 0.5%, according to the
specific process appropriate adjustments.
Package,transportation and storage:
IBC Packaging
Storage in ventilation, cool, dry place
Notes:
1. Storage in the process of prevent oil mixed with water,
otherwise may cause product deterioration.
2. If the liquid color getting darker durings storage or in the
process of using,does not affect the use effect.
3. Do not eat,rinse it with clean water immediately if it gets into
eyes accidentally. serious hospital for treatment.
