Pcb/Pcba/Single-side pcb/FR-4/Cem/Printed Circuit Board/Smt
Our Advantages:
1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC,
100% functional test.
3. Professional service: PCB/FPC/Aluminium Making, SMT, DIP,
Component Sourcing, OEM with 21 years experience.
4. Certifications: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001,
ISO14001,IATF16949
Advantages of single layer circuit board
(1) Low cost: The manufacturing cost of single-layer PCB board is
relatively low, because only one layer of copper foil and one layer
of substrate are needed, and the manufacturing process is
relatively simple.
(2) Easy production: Compared with other structural types of PCB
board, the production method of single-layer PCB board is
relatively simple, only need to carry out single-side wiring and
single-layer corrosion, so the production difficulty is low.
(3) High reliability: Single-layer PCB board does not have
multi-layer wiring and connection, so it is not easy to
short-circuit and interference problems, with high reliability.
(4) Suitable for simple circuit: single-layer PCB board is suitable
for simple circuit design, such as LED lights, sound, etc., can
meet most of the low complexity of the circuit requirements.
| Material | CEM-1, CEM-3, FR-4, Aluminum, Rogers, high Tg etc. |
| Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| Surface finish | HASL, OSP, Immersion Gold/Silver/Tin, ENIG, Gold Finger |
| PCB Max panel size | 1150mm × 560mm |
| Layer | 1-64 L |
| Min hole size | Mechanical drill: 6mil(0.15mm) Laser drill: 3mil(0.075mm) |
| PCBA QC | X-ray, AOI Test, Functional Test,QC, QA, QE |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity,
Partial-hybrid, Partial high density, Back drilling, impedance
requirement, and Resistance control. |
| Our service | PCB manufacturing, Procurement of Components, SMT/DIP PCBA
assembly, Line and functional test, Installation, OEM service |
| Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance,
Embedded Capacitance, Local Mixed Pressure, Local High Density,
Back drill, impedance control. |
| SMT Capacity | 700Million Points/Day, BGA 01005 |
| DIP Capacity | 0.5Million Points/Day |
| Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |
