SGS Customized 4 Inch PC Waffle pack Bare Die Tray 648PCS Storage
The waffle pack is the carrier of semiconductor chip packaging,
mainly used for inspection, storage and transportation. Hiner-pack
offers a wide selection of 4" waffle pack, covers and
accessories,which can meet your specific bare mold, chip scale and
wafer scale packaging shipping and processing needs. They are
available in various pocket sizes and depths. The products are
designed and manufactured to provide reliable protection while
minimizing your shipping and storage costs.
The Details of the HN22025 Waffle Pack
Compared to traditional packaging, the service life of waffle pack
is five to seven times longer. At the same time, it is made of PC
material. The product is not only small size and light weight,
which is very suitable for the transportation of small naked mold.
For specific 1.45*2.85*0.88 mm pocket size, we design the most
reasonable 36*18 matrix. This design can accommodate the maximum
amount of customer products.
In addition, the warpage of the product is strictly controlled
below 0.3mm. From raw material selection, mold manufacturing,
production to packaging, all steps and operations have strict
quality control. IC trays have different manufacturing formats to
accommodate different sizes of IC chips. We can also customize to
suit different sizes of products according to customer needs.
| Outline Line Size | 101.6*101.6*5.5mm | Brand | Hiner-pack |
| Model | HN22025 | Package Type | Die |
| Cavity Size | 1.45*2.85*0.88 | Matrix QTY | 36*18=648PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS ISO9001 |
The Application of HN22025 Chip Tray
IC Packaging Delivery Systems Embedded Systems
Micro and Anon Systems Micro and Nano Systems
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
Our Service
1. We have sample stock, also can help the client to choose which
type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients'
requirement.
4. After mold customization, free samples will be provided until
the customer tests OK, so as to remove the mass production quality
concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10
years with 1500 square meters workshop area, located in Shenzhen
China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you
according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we
can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee
should be paid by yourself.
