Black Dustproof 2 Inch Waffle Pack Chip Tray for IC Storage
The waffle pack is utilized for the transportation and storage of
chips, with the intention of minimizing chip exposure to air. It is
imperative that bare hands do not come into contact with chip
product storage containers, even when outside clean areas. Regular
cleaning of chip tray product is necessary, and if visible
contaminants are detected, immediate cleaning of the waffle pack
must be carried out.
In addition, some thin products loaded in these waffle trays may
shift during transportation, resulting in collision damage or
products falling out of the lattice. To address this issue, a
matching lid and clamp have been specially developed for use with
the trays. The clamp securely fastens the tray and lid together to
prevent any incidents of detachment.
The Details of the HN22029 Waffle Pack Chip Tray
The HN22029 waffle pack is primarily composed of polycarbonate (PC)
material, a widely utilized industrial substance renowned for its
exceptional structural stability and heat resistance properties.
Its tray features an evenly distributed matrix pocket design that
optimizes loading efficiency through professional matrix
engineering. Customers can select the appropriate waffle pack size
based on their product dimensions, while the 45-degree chamfer
design effectively prevents stacking errors.
Meanwhile, the service life of this waffle pack is 5-7 times longer
than that of traditional packaging. Moreover, it can be easily
recycled after disposal without causing any environmental pollution
concerns for customers. As a professional tray manufacturer,
Hiner-pack strictly controls every step and operation from design
drawing to mold manufacturing, production and packaging to ensure
quality service delivery.
| Outline Line Size | 50.8*50.8*4mm | Brand | Hiner-pack |
| Model | HN22029 | Package Type | Die |
| Cavity Size | 2.3*3.5*0.4 | Matrix QTY | 15*11=165PCS |
| Material | PC | Feature | ESD,Dustproof |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Product Application
Electronic Component Embedded System
Micro and Anon System Sensor Test and Measurement Technology
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
Advantages
1.Light weight, saving transportation and packaging costs.
2.Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack
Feeder Machine.
3.Good anti-static performance, effectively ensure that the product
is not damaged by anti-static release.
4.High temperature resistance, suitable for high temperature
automation equipment assembly.
5.Corrosion resistance, suitable for all kinds of production
conditions of products.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10
years with 1500 square meters workshop area, located in Shenzhen
China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you
according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we
can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee
should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly
please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something
we have stock.
