1.5mmT UL recognized 1.5W/MK Self Adhesive Hthermal conductive gap
filler for Automotive electronics
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
TIF100-05ES-Datasheet.pdfThe TIF160-05ES is an extremely soft gap filling material rated at a
thermal conductivity of 1.5 W/m-K. It is specially formulated for
high performance applications requiring low assembly stress. The
material offers exceptional thermal performance at low pressures
due to the unique filler package and ultra low modulus resin
formulation. TIF160-05ES is highly conformal to rough or irregular
surfaces, allowing excellent wet-out at the interface. Protective
liners are supplied on both sides allowing for ease of use.
Features
<Good thermal conductive:1.5 W/mK
<Thickness:1.5mmT
<Hardness:12±5 Shore 00
<RoHS compliant
<UL recognized
<Fiberglass reinforced for puncture, shear and tear resistance
Applications
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
<LED Ceilinglamp
<Monitoring the Power Box
<AD-DC Power Adapters
<Rainproof LED Power
Typical Properties of TIF160-05ES |
Product Name | TIF160-05ESSeries |
Colour | Blue |
Construction & Compostion | Ceramic filled silicone rubber |
Density | 2.0 g/cm3 |
Thickness | 1.5mmT |
Hardness | 12±5 Shore 00 |
Tensile Strength | 40 psi |
Continuos Use Temp | -40to 160℃ |
Dielectric Breakdown Voltage | >5500 VAC |
Thermal conductivity | 1.5 W/mK |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Advantage
Ziitek has independent R&D team. This team is experience,
rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek
thermal conductive materials. With well-equipped testing equipment,
we Ziitek can also do some tests with customers' samples, so we can
find a more suitable Ziitek materials for every customer.
