WCu Alloy Material Heat Sink High Hermeticity With 115 - 260 Hardness

WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 15 wt.% Cu

Description:

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.

Advantages:

1. Excellent hermeticity

2. Semi-finished or finished (Ni/Au plated) products available

3. Low porosity

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Product Properties:

Zhuzhou Teyou New Material Co.,Ltd owned lots of elites specialize in refractory metal industry and precision machining industry as a pioneering enterprise focus on technology innovation,who stepping up efforts to serve for emerging industries of strategic importance and providing full set design solution required by global customers. Including machinery and mechanical design , material selection, production plant layout, the installation and transportation of equipments ,etc. We have already been desgined plenty of sets of hot zone and high-termerature sintering equipments successfully.