Sign In | Join Free | My burrillandco.com
Home > Other Metals & Metal Products >

Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging

    Buy cheap Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging from wholesalers
     
    Buy cheap Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging from wholesalers
    • Buy cheap Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging from wholesalers

    Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging

    Ask Lasest Price
    Brand Name : JBNR
    Model Number : 50WCu,75WCu,80WCu,85WCu,90WCu
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    Price : Negotiable
    • Product Details
    • Company Profile

    Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging

    Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging


    Description:


    W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.


    Advantages:


    1. High thermal conductivity

    2. Excellent hermeticity

    3. Excellent flatness, surface finish, and size control

    4. Semi-finished or finished (Ni/Au plated) products available

    5. Low void


    Product Properties:


    GradeW ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    90WCu90±2%17.06.5180 (25℃) /176 (100℃)
    85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
    80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
    75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
    50WCu50±2%12.212.5340 (25℃) / 310 (100℃)

    Application:


    These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.


    Product picture:


    Quality Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging for sale
    • Haven't found right suppliers
    • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
    • And this service is free of charge.
    • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
    Submit Buying Request
    Send your message to this supplier
    *From:
    Your email address is incorrect!
    *Subject:
    Your subject must be between 10-255 characters!
    *Message:
    For the best results, we recommend including the following details:
    • --Self introduction
    • --Required specifications
    • --Inquire about price/MOQ
    Your message must be between 20-3,000
    Yes! I would like your verified suppliers matching service!
    Send your message to this supplier
     
    *From:
    *To: Zhuzhou Jiabang Refractory Metal Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Explore more Hermetic Packages Electronics products from this supplier
    Find Similar Products By Category:
    Inquiry Cart 0