Gold Plated Tungsten Copper Heat Spreader , Microelectronic
Packaging Tungsten Copper Submount
Description:
W-Cu heat sink material is a composite of tungsten and copper, with
both tungsten low expansion characteristics, but also has copper of
high thermal conductivity properties, and the tungsten and copper
in the thermal expansion coefficient and thermal conductivity can
be adjusted with the W-Cu composition, also the composite can be
machined to various shape, these features make the application of
this composite with great convenience. The thermal expansion can be
adjusted to match with the following material:
(1) Ceramic materials: Al2O3(A-90,A-95,A-99),BeO(B-95,
B-99),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs
etc.;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
They are extensively used as thermal mounting plates, chip
carriers, tungsten copper flanges, and frames for RF, light
emitting diodes and detectors, laser diode packages like pulse,
single emitter, bars and complex carriers for optoelectronics
amplifiers, receivers, transmitters, tunable lasers, etc.
Product picture:
