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Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )

    Buy cheap Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) from wholesalers
     
    Buy cheap Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) from wholesalers
    • Buy cheap Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) from wholesalers
    • Buy cheap Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) from wholesalers

    Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )

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    Brand Name : JBNR
    Model Number : HCMC021
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 20 days
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    Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )


    Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits (I/C)


    Description:

    With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.

    For sensitive components, to use metal composite like molybdenum copper material is a wise choice.

    Molybdenum copper is a composite with molybdenum and copper. By combining these two materials together, we can have adjustable CTE and TE. If you have any doubt about how to choose materials, you can come to us, our engineer will give you references.


    Advantages:


    • High thermal conductivity since no sintering additives have been used
    • Excellent hermeticity
    • Relatively small density
    • Stampable sheets available (Mo content no more than 75 wt%)
    • Semi-finished or finished (Ni/Au plated) parts available

    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)


    Applications:

    Molybdenum copper have been used as Heat Sinks & Pedestals For Integrated Circuits (I/C).

    It is also used in applications like opto-electronics, high-frequency applications, power electronics and micro-electronics.

    In these sectors, they are often employed in below components like:


    GaN/GaAs transistors

    Ceramic packages used in microwave and RF fields

    Components in radio base station of telecommunication

    High-power LEDs

    IGBT modules for EV/HEV and stationary transformers

    Quality Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) for sale
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