Excellent Hermeticity Through Nickel And Gold Plating Mocu Heat
Sink For Rf Amplifiers
Description:
With technology development, there are more need for higher power
in smaller microelectronics components. This also increase the
requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum
copper material is a wise choice.
Case study:
For radar systems, our customers need custom-shaped electronics
heat sink for its channels.
The dimensions of the part is about 0.2mm thickness, 4.5mm width,
and 6.8mm length.
To reach a good thermal conductivity, we offer 70Mo30Cu for its
application.
The molybdenum copper heat sink is nickel plated based on the
specification in SAE AMS-C26074 and gold plated based on the
specification Mil-G-45204C.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper have been used in various fields like
opto-electronics, high-frequency applications, power electronics
and micro-electronics.
In these sectors, they are often employed in below components like:
GaN/GaAs transistors
Ceramic packages used in microwave and RF fields
Components in radio base station of telecommunication
High-power LEDs
IGBT modules for EV/HEV and stationary transformers
