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LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

    Buy cheap LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation from wholesalers
     
    Buy cheap LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation from wholesalers
    • Buy cheap LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation from wholesalers

    LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

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    Brand Name : JBNR
    Model Number : CMC111,CMC121,CMC131,CMC141,CMC13/74/13
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
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    LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation


    LDMOS RF Transistor Cu/Mo/Cu Flanges With Good Heat Dissipation

    Description:


    Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

    Advantages:

    1.Can be stamped into components
    2.Strong interface bonding resist to 850℃ heat shock repeatedly
    3.High thermal conductivity

    Product Properties:

    GradeDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    CMC1119.328.8305(XY)/250(Z)
    CMC1219.547.8260(XY)/210(Z)
    CMC1319.666.8244(XY)/190(Z)
    CMC1419.756220(XY)/180(Z)
    CMC13/74/139.885.6200(XY)/170(Z)

    Application:

    Cu/Mo/Cu(CMC) carrier has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.


    Product picture:

    Quality LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation for sale
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