Tungsten Copper Base Circuit Board

Tungsten Copper Base Circuit Board Hermetic Packages Electronics For Metal Package

Good Thermal Conductivity Tungsten Copper Base Circuit Board For Metal Package

Description:

Tungsten Copper is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc.


Advantages:

1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void

Product Properties:

Application:

1. Used as high temperature resistance in electronic products and Auto-Engines. Like Computer generates vast amounts of heat, which results in the slow of speed.Tungsten alloy heat sink can solve this problem.

2. Used in applications such as optoelectronics packages, Microwave Packages, Packages, Laser Submounts, etc.

3. Used as heat sink pieces and encapsulation shell.

4. Used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable Lasers.

Product picture:

Zhuzhou Jiabang Refractory Metal Co.,Ltd, founded in year 2008, has an area coverage of 12000m2. Its registered capital is RMB 30 million. 
Zhuzhou Jiabang Refractory Metal Co.,Ltd is devoted in research and production of products in electronics area, medical area, new energy industry and aeronautical and space industries etc.
The main products are pure tungsten, pure molybdenum, tungsten copper, molybdenum copper, Cu/Mo/Cu (CMC), Cu/MoCu/Cu (CPC) and tungsten heavy alloy etc., 
JB possesses a highly-qualified technical team which has solid theoretical guidance and extremely rich practising experience in the aspects of powder metallurgy, press processing and shape processing. Besides, an energetic technical team with appropriate ages is full of powerful creative spirits and exploratory capabilities.
From year 2014, we have begun the reseach and development for hermetic package materials and heat sink materials. And until now, we have input about RMB 15 million to upgrade the machines. With years of development, the properties of heat sinks have already reached the international quality level.

JBNR will continuously hold the belief of "customer foremost, requirements fulfilled, improvement continued, and world class pursued" and cooperate closely with customers, contriving to gain a win-win situation and develop together with customers in the fierce market competition. Welcome people from all fields and customers from abroad and home to consult technology, do business and cooperate together.