ROHS PC JEDEC Matrix Tray For IC Device 0.76mm Flatness
The JEDEC matrix tray is mainly used for chip packaging testing in
the semiconductor industry.Because IC chips are tiny and thin, they
are extremely vulnerable to damage during storage and
transportation. So customers often use the JEDEC tray for packaging
protection. It is a standard tray used to transport, store and pack
the electronic components. The products not only comply with JEDEC
international standards and ROHS environmental protection
standards, but also fully meet the packaging requirements of
various chips. We can customize the perfect tray according to
customers' requirements.
The Details of the HN22009 JEDEC Matrix Tray
The JEDEC trays have the same outline size of 12.7 inches * 5.35
inches (322.6 mm * 135.89 mm),HN22009 is made primarily of PC
materials with excellent strength, flame retardant and many other
properties. It not only can prevent external damage to customers'
products, but also do not pollute the environment.
At the same time, 3*8 matrix pockets are distributed inside the
tray. The spacing between the pockets also allows the automation
equipment to locate the product more accurately. The tray is not
only small in size and light in weight, its warping degree is less
than 0.76mm to perfect stacking. Thus it can greatly reduce the
customer's transportation and storage costs.
| Outline Line Size | 322.6*135.9*20.23mm | Brand | Hiner-pack |
| Model | HN22009 | Package Type | N/A |
| Cavity Size | 31*21.5*16.2mm | Matrix QTY | 3*8=24PCS |
| Material | PC | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application The HN22009 JEDEC Tray
Electronic Component Test and Measurement Technology
Military Industry Power Supply
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
Our Service
1. We have sample stock, also can help the client to choose which
type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients'
requirement.
4.After mold customization, free samples will be provided until the
customer tests OK, so as to remove the mass production quality
concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans: We are the 100% Manufacturer specialized in packaging over 10
years with 1500 square meters workshop area, located in Shenzhen
China.
Q2:What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Ans: Yes, we can accept your customization and do the packaging for
you according to your requirement.
Q4: How can I get quotation of the custom products ?
Ans: Let us know the size of your IC or component thickness,and
then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Ans:Yes, the free sample in stock can be sent, but the shipping fee
should be paid by yourself.
Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo on our products, show us your logo
firstly please.
Q7: When can we get the samples?
Ans: We can send you them right now if you are interested in
something we have stock, and customize, the project depending on
the interested.
