China Manufacturer Black PC 2 Inch Waffle Pack Chip Tray
In order to effectively protect the bare chip during
transportation, it is very important to choose the right packaging.
Because the products can be affected by a variety of factors during
storage and transportation, including movement within the pocket,
contact of the top surface, electrostatic discharge (ESD), and even
exposure to the air. These conditions can damage the product,
resulting in reduced the quality of production.
As the packaging specialists, Hiner-pack can help you choose the
waffle pack that best meets your needs while protecting your bare
chip from corrosion and ESD. The IC chip tray have been tested by
ROHS and SGS and other third-party institutions. Before shipment,
the quality department must confirm that the products are 100%
qualified. For many years, our products have been sold to famous
customers at home and abroad. Rich experience in injection molding
industry can provides customers with the most suitable packaging
solutions.
The Details Of The HN22007 Waffle Pack
The HN22007 Waffle pack is designed to provide clean, secure
packaging for bare molds and other electronic chips. It also has a
variety of functions such as bending resistance, bearing strength
and high temperature resistance. The 7*8 matrix pocket design can
also accommodate more customers' products. Customers choose the
chip tray they want according to the size of the pocket. This is to
avoid the device spinning or flipping in the pocket.
At the same time, we can provide professional customized services
according to customer requirements. Customized trays of various
sizes for customers to achieve the most reasonable loading. In
addition, there are matching lid, clip,Tyvek paper for customers to
choose. We are honored to bring excellent service to our customers.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN22007 | Package Type | Die |
| Cavity Size | 3.55*4.65*0.85 | Matrix QTY | 7*8=56PCS |
| Material | PC | HS Code | 3923900000 |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN22007 Waffle Pack Chip Tray
Electronic Component Semiconductor
Micro and Nano Systems Sensor IC
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" waffle pack
feeder machine.
3. Good anti-static performance, effectively ensure that the
product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature
automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production
conditions of products.
6. Matrix arrangement design, under the premise of protecting the
product, the maximum capacity design, cost saving.
7. Edge chamfer design, effectively prevent stacking error, correct
the direction of placement.
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days
around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and
ruled by our QC staff.
