5W / MK,UL Recognized Thermal Conductive Gap Filler 4.5mmT,45
Shore00 With Grey Colour For RDRAM Memory Modules
5W / MK,UL recognized thermal conductive gap filler 45 shore00 with
grey colour For RDRAM memory modules
The TIF5180-50-11US iis an extremely soft gap filling material rated at a thermal
conductivity of 5 W/m-K. It is specially formulated for high performance applications
requiring low assembly stress. The material offers exceptional
thermal performance at low pressures due to the unique filler
package and ultra low modulus resin formulation. The TIF5180-50-11US is highly conformal to rough or irregular surfaces, allowing
excellent wet-out at the interface. Protective liners are supplied
on both sides allowing for ease of use.
TIF500-50-11S Datasheet-REV02.pdf
Features:
> Good thermal conductive: 5.0W/mK
>Thickness:4.5mmT
>Soft and compressible for low stress applications
>Outstanding thermal performance
>Fiberglass reinforced for puncture, shear and tear resistance
>Electrically isolating
Applications:
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Semiconductor automated test equipment (ATE)
>CPU
>Memory Modules
>Mass storage devices
>Automotive electronics
Typical Properties of TIF5180-50-11S |
| Color | Grey | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 |
| Specific Gravity | 3.15 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 |
| Thichness | 4.5mmT | *** | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 |
| Hardness | 45 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 |
| Tensile Strength | 55 ps | ASTM D412 | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 |
| Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 |
| Volume Resistivity | 4.0X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Advantage
Ziitek has independent R&D team. This team is experience,
rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek
thermal conductive materials. With well-equipped testing equipment,
we Ziitek can also do some tests with customers' samples, so we can
find a more suitable Ziitek materials for every customer.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
