2.5mmT Ultra Soft 20shore00 Thermal Gap Filler UL Recognized For Mass Storage Devices

Ziitek TIF5100-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

TIF500-50-11US Datasheet-REV02.pdf

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

<Good thermal conductive:5.0W/m-k

<Thickness:2.5mmT

<Moldability for complex parts

<RoHS compliant

<Electrically isolating

<High durability

<Mass storage devices

<Automotive electronics

<Automotive engine control units

<Telecommunication hardware

<LED Controller

<LED Ceilinglamp

<Monitoring the Power Box