0.95mm Anylayer HDI / 12Layer mainboard / EM370D CCL / UFS and OSC
area OSP treatment
Benefits or advantages of HDI PCB
Following are the benefits or advantages of HDI PCB:
➨It allows more components in small board areas as HDI PCBs are
populated on both the sides. Hence HDI PCB offers denser trace
routing.
➨It decreases power usage as a result long battery life can be
achieved.
➨It offers light weight and small size PCBs.
➨Fast signal transmission with enhanced signal quality can be
achieved using HDI PCB.
➨It offers space to mount more components compare to traditional
PCB.
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which
has a higher wiring density per unit area as opposed to
conventional board is called as HDI PCB. HDI PCBs have finer spaces
and lines, minor vias and capture pads and higher connection pad
density. It is helpful in enhancing electrical performance and
reduction in weight and size of the equipment. HDI PCB is the
better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board
should have various features i.e. high-frequency transmission
capability, impedance control, decreases redundant radiation, etc.
The board should be enhanced in the density because of the
miniaturization and arrays of the electronic parts. In addition, to
the result of the assembling techniques of leadless, fine pitch
package and direct chip bonding, the board is even featured with
exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed,
small size and high frequency. It is the primary part of portable
computers, personal computers, and mobile phones. Currently, HDI
PCB is extensively used in other end user products i.e. as MP3
players and game consoles, etc.
2 . Specifications:
| Name | 1.0mm Plus3 HDI / 10L mainboard |
| Number of Layers | 10 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM390 |
| Thickness | 1.0mm |
| Min Track/Spacing | 50um/60um |
| Min Hole Size | Laser 75um; Drilling size 200um |
| Solder Mask | Blue |
| Silkscreen | White |
| Surface Finish | Immersion gold,OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
3. Advantages:
The most common reason for using HDI technology is a significant
increase in packaging density. The space obtained by finer track
structures is available for components. Besides, overall space
requirements are reduced will result in smaller board sizes and
fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI
technology makes routing and connection easy, especially when
routing between pins.
