0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests.

Burn in boards utilize high grade materials. For testing up to 125C a special version of FR4 is used (High Tg FR4). For higher temperatures up to 250C a Polyimide is used; and for very high temperatures up to 300C a High grade polyimide is used.

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Our PCBs facility is located at East China, closed to Shanghai City.

We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.