HDI Burn In Test PCB Circuit Board Contract Manufacturing

12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

In addition to the typical PCB design guidelines which are quite common among all PCB designers, there are a few additional factors for making a Burn in Board. One of the most important considerations is selecting the highest possible reliability and quality for the Burn in Board and the test socket. You don’t want your Burn in board to fail before the device under test. Therefore, all active/passive components and connectors should comply with high-temperature requirements, and all materials and components should meet high-temperature and aging requirements.

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Our PCBs facility is located at East China, closed to Shanghai City.

We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.