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HDI Board SMT Assembly Service 12 Layer PCB One-Stop Service

    Buy cheap HDI Board SMT Assembly Service 12 Layer PCB  One-Stop  Service from wholesalers
     
    Buy cheap HDI Board SMT Assembly Service 12 Layer PCB  One-Stop  Service from wholesalers
    • Buy cheap HDI Board SMT Assembly Service 12 Layer PCB  One-Stop  Service from wholesalers

    HDI Board SMT Assembly Service 12 Layer PCB One-Stop Service

    Ask Lasest Price
    Brand Name : JIETENG
    Model Number : PCBA
    Certification : ISO/TS16949/RoHS/TS16949
    Price : Negotiable
    Payment Terms : Negotiable
    Supply Ability : 100000 Piece/Pieces per Month
    Delivery Time : 3-10 days delivery
    • Product Details
    • Company Profile

    HDI Board SMT Assembly Service 12 Layer PCB One-Stop Service

    HDI board 12 layers of arbitrary level PCB board board buried blind hole board high frequency gongs military


    Essential details
    Model Number:
    PCBA
    Type:
    home appliance pcba
    Place of Origin:
    Guangdong, China
    Brand Name:
    PCB&PCBA
    Supplier Type:
    PCB,PCBA,FPC,HDI,RFPC
    Copper Thickness:
    1 oz
    Item:
    Wonderful PCB&PCBA Manufacturer in Shenzhen
    Maximum Processing Area:
    680 x 1000MM
    Silkscreen Color:
    Black, White, Red, Green
    Keywords:
    OEM contract manufacturing PCB
    Material:
    FR4 ,Any specialized material as per your choice
    Service:
    One-Stop Service
    MOQ:
    1 PC
    Delivery time:
    Sample is available within 3days
    Application:
    Electronic product
    Certificate:
    ROSH. ISO9001.

    PCB Capability
    Number of Layer
    1 - 20 Layer
    Maximum Processing Area
    680 × 1000MM


    Min Board Thickness
    2 Layer - 0.3MM ( 12 mil )
    4 Layer - 0.4MM ( 16 mil )
    6 Layer - 0.8MM ( 32 mil )
    8 Layer - 1.0MM ( 40 mil)
    10 Layer - 1.1MM ( 44 mil )
    12 Layer - 1.3MM ( 52 mil )
    14 Layer - 1.5MM ( 59 mil )
    16 Layer - 1.6MM ( 63 mil )
    18 Layer - 1.8MM ( 71 mil )
    Finished Board Thickness Tolerance
    Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
    1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
    Twisting and Bending
    ≤ 0.75%, Min: 0.5%
    Range of TG
    130 - 215 ℃
    Impedance Tolerance
    ± 10%, Min: ± 5%
    Hi-Pot Test
    Max: 4000V/10MA/60S


    Surface Treatment
    HASL, With Lead, HASL Free Lead
    Flash Gold, Immersion Gold
    Immersion Silver, Immersion Tin
    Gold Finger, OSP

    Our advantage
    Material Technology
    Our Production
    General Production
    Regular/Special
    1.Our (TG170)FR4:
    high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good
    performance in electrical charge, impact resistance, humidity-resistance

    2.Our FR4
    good performance in electrical charge, impact resistance, humidity-resistance

    3.Our CEM
    no-burr

    4.Our Rogers
    Good performance in high frequency

    5.Our Aluminum
    Excellent heat dispersion
    1.General FR4
    High heat work

    2.General CEM
    Expand and deform in damp conditions
    Factory
    We have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes
    surface brighter, cleaner and more smooth, and it helps reduce the cost.
    Artificial production line
    Blind/buried via board, High Density Interconnect(1+1,N+1)
    Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design.
    Difficult manufacturer, high cost
    Impedance
    Good performance in reliability and stability of signal sending and receiving
    High cost
    Surface Technics
    1.IMG:smooth surface, good adhesion, no oxidation under long using
    2.gold plating(thick gold:1-50U"):good wear-resistance
    3.HASL:better price, not easy oxidation, easy to welding, smooth surface
    4.HAL: better price, not easy oxidation, easy to welding
    1.IMG:high price
    2.Gold plating(thick gold):high price
    3.HAL:surface is not flat, not suitable for BAG packaging
    Copper Via/Surface(20-25UM,0.5-60Z)
    Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM
    Hard to reach 0.1MM
    Multilayer board(4-20 L),BGA(CPU)
    BGA:high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN
    width/space: 3/3MIL

    Multilayer board:strong microporous, high reliability
    Difficult manufacturer,high cost
    Test
    To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework
    Careless


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