PI film heat-resistant protection film
Base film: PI film
Adhesive: silcone adhesive
Appearance:
Amber transparent, surface smooth, no crepe,bubble,foreign
objects,no tearing and transfer of glue layer when unwinding
Charactor:
1. Base material with high mechanical strength, good electrial
insulation strength, size stable, high temperature resistant.
2. High bonding strength, heat resistant, no adhesive residue after
peeling off.
3. Long term working temperature: 180°C, short term 280°C.
| Type # | K2304 |
| Total thickness mm | 0.035±0.003 |
| Base film thickness mm | 0.0125±0.003 |
| Break down voltage KV/mm | ≥75 |
| Weight g/m2 | 45 |
| Tensile strength N/10mm | ≥30 |
| Elongation % | ≥40 |
| Adhetion strength to steel N/10mm | ≥1.5 |
| Working temperature °C | -73~300 |
Application:
1. Electronic protection during bonding process: especially
suitable for SMT wave soldering, temperature protection of reflow
soldering, electronic switches, PCB board gold finger protection,
SMD electronic transformers, relays and other electronic components
that require high temperature and moisture protection.
2. Electrical insulation wrapping: used for coil insulation
wrapping of high-demand H-class motors and transformers, wrapping
and fixing the ends of high-temperature coils,
temperature-resistant thermal resistance protection and other
bonding insulation under high-temperature working conditions
Storage:
Packed by plastic film and bag, and then in cartons. Room
temperature storage, dust-proof and humid-proof, storage period:
12months.
