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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

    Buy cheap 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics from wholesalers
     
    Buy cheap 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics from wholesalers
    • Buy cheap 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics from wholesalers
    • Buy cheap 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics from wholesalers
    • Buy cheap 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics from wholesalers

    9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

    Ask Lasest Price
    Brand Name : HUITIAN
    Model Number : 9504
    Certification : RoHS
    Price : Negotiation
    Payment Terms : L/C, T/T
    Supply Ability : 2000T/Month
    Delivery Time : 5-8 days
    • Product Details
    • Company Profile

    9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

    9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage


    Product Description


    • Pink paste gel
    • One-part pre-curing type
    • Silicone thermal conductivity complex

    Product Features:


    • High thermal conductivity 4W/m∙K
    • Very small BLT and very low thermal resistance
    • Soft adhesion and self-adhesive properties after dispensing
    • Excellent chemical and mechanical stability
    • No residual stress after sizing, effectively protects precision electronic components from damage


    Technical Parameters

    Reference standardItemUnitValue
    GB/T 13354Densityg/cm33.2
    --Extrusion rate
    (30ccEFD@90psi)
    g/min30
    ISO22007Thermal conductivityW/ m·K4.0
    GB/T2408Flame retardant/V0
    GB/T2408Volume resistivityΩ·cm≥1.0×1013
    ASTM D149Dielectric strengthKv/mm8.0
    ASTM D5470Minimum thicknessmm0.1

    Main Applications:

    • Bare die chip low-stress mounting
    • Heat dissipation field of 5G communication boards
    • Automotive electronic equipment
    • Smart phone modules and consumer-electronics
    • Other high-value boards need to be reworked

    Packing:

    30cc/tube; 300cc/tube


    Storage:

    Store below 35°C in a cool and dry place.

    Shelf life is 6 months.

    Quality 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics for sale
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