Custom Black Conductive ESD Component JEDEC Matrix Trays For IC
Device Storage
Built for precision fit and reusability, our JEDEC trays simplify
component handling from fab to final test.
This JEDEC matrix tray is engineered to meet the precision and
efficiency demands of modern electronics manufacturing. Designed
for seamless integration with automated systems, it offers reliable
positioning and static protection for a wide variety of components.
The tray’s rugged construction supports repeated handling cycles
without warping or deformation, while its intelligent design
features contribute to safe, accurate operation throughout
transport, processing, and storage. Trusted across industries, it
provides a robust packaging and handling solution for even the most
delicate electronic parts.
Features & Benefits:
• JEDEC-Compliant Structure: Built to industry-standard outline and
configuration for guaranteed compatibility with pick-and-place
systems and tray feeders.
• ESD-Safe Composition: Ensures secure protection for
static-sensitive parts throughout assembly and testing stages.
• Precision Pocket Layout: Engineered for tight part retention and
uniform placement, enabling error-free operation in high-speed
workflows.
• Automation Support Features: Includes standard alignment and
orientation markers that work with automated visual and mechanical
systems.
• Stacking Stability: Optimized tray interface design supports safe
vertical stacking without shifting or misalignment.
• High Material Resilience: Maintains form and strength across
repeated cycles of loading, unloading, and transport under standard
manufacturing conditions.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*12.5mm |
| Model | HN23028 | Cavity Size | 11.4*16.9*1.14mm |
| Package Type | N/A | Matrix QTY | 13*7=91PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Applications:
Ideal for a wide range of manufacturing and handling tasks, this
tray serves semiconductor production lines, automated testing
equipment, and packaging systems. It is frequently used to
transport and store microelectronic devices, ensuring their
alignment and protection during transitions between production
phases. The tray’s standardization also allows for its use in
cross-platform production setups, making it suitable for global
supply chain operations.
Customization:
The tray is available with multiple customization options to suit
specific operational or device needs:
• Tailored Pocket Geometry: Modify shape and depth to support
custom chip packages, modules, or hybrid assemblies.
• Color Coding Options: Multiple material color variants available
for line segmentation, part tracking, or inventory management.
• Molded Part Identifiers: Incorporate logos, serial numbers, or
batch indicators for internal traceability and process validation.
• Automation Compatibility Adjustments: Alter specific features to
better align with proprietary robotic arms, elevators, or handling
systems.
