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3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison

    Buy cheap 3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison from wholesalers
     
    Buy cheap 3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison from wholesalers
    • Buy cheap 3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison from wholesalers
    • Buy cheap 3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison from wholesalers

    3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison

    Ask Lasest Price
    Brand Name : MENTO
    Model Number : k3205
    Certification : FCC.ROHS,CCC
    Payment Terms : L/C, T/T
    Supply Ability : 10pcs+20 work days
    Delivery Time : 20 work days
    • Product Details
    • Company Profile

    3D AOI Machine High Precision Solution for Solder Paste Inspection and 5 megapixel 3D measurement and comparison

    K32 series 3D Solder Paste Inspection


    Device modelK3205
    Detection capacityDetection itemsMiss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset
    Scanning methodStop&Go
    Optical systemCamera5MP high speed color industrial camera
    Light SourceDual DLP light source (raster phase shift technology) and red, green and blue (RGB) light source
    Resolution10μm & 15um (optional)
    Detection performanceHeight accuracy (calibration module)1μm (using standard calibration block)
    Volume repeatability<1% (standard verification block, 3Sigma)
    Maximum Plate Bending Compensation Value±3mm
    Detection Capability GRR<10%at6o(+50%tolerance, 5μm resolution)
    Maximum detection height500μm
    Solution to shadow problemPhase shift technology & bidirectional 3D Structured Light system
    Plate bending real-time compensation methodPlate Bend Compensation (Z-Tracking+Pad Referencing)
    Test screenColor (3D and 2D images displayed together)
    Driving equipmentServomotor+Screw Guide
    Moving speed800mm/s
    Minimum measurable product size50mmx50mm
    Maximum product measurable size400mmx500mm
    PCB thickness0.5~6mm
    Track width adjustmentAutomatic width adjustment, manual width adjustment
    Circuit board conveying/fixingBelt conveyor/pneumatic clamp fixing
    Conveying directionFrom left to right, right to left
    Orbital height900±20mm
    Computer ConfigurationMainframeCPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T
    Monitor22"LED
    Operating systemUbuntu
    ParametersOverall sizeW1350xD1000xH1600mm (excluding alarm light)
    Weight1100KG
    Power sourceAC220V/50~60Hz/2000W
    Air Pressure0.5Mpa
    Software Supported Input FormatsSupport Gerber format (274X), ODB++
    Statistical management tools

    Histogram,X-bar&R -Chart ,X-bar&S -C hart ,C p&C pk,

    %Gage R & R,SPI Daily/Weekly/Monthly Reports, real-time SPC& Multiple Display

    Environmental requirementsTemperature: 5~40℃, relative humidity: 25%~80% (no frost)
    Upstream and downstream equipment communicationStandard SMEMA interface

    Phase profile measurement principle

    Object deforms (modulates) the sinusoidal pattern

    Calculate sinusoidal phase and find height (demodulation)


    Anti-interference, high precision, large range

    1. The moving stripes ensure the ability to resist ambient light interference.

    2. High-frequency stripes ensure high enough vertical resolution

    3. Low-frequency stripes ensure a wide enough measuring range.



    Comprehensive MES data interfacing capabilities and powerful SPC system

    1. Real-time statistics of the top ten alarm components

    2. The number of alarms can be set to lock the machine

    3. Export the entire board image of each PCB in real time for subsequent traceability


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